Amkor Assembly & Test (Shanghai) Co., Ltd.
Location
Shanghai
Founded
2001-08-28
Website
Risk Signals
410 news mentions monitored
Industry Context
This company is tracked across risk categories, including those related to its sector (e.g., Semiconductors and Related Devices, Electronic Parts and Equipment, Not Elsewhere Classified, Business Services, Not Elsewhere Classified), including supply chain integrity, ESG practices, labor disputes, and regulatory compliance.
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Recent Articles about Amkor Assembly & Test (Shanghai) Co., Ltd.
Live alerts from global media, monitored by Business Radar
2025-04-02 (stockfeel.com.tw)
Amkor Technology (AMKR) - the world's second largest semiconductor packaging and testing company - Stocks
Aikel's business is to provide chip packaging and testing services. The packaging is to coat the wafer with plastic, ceramic and other materials to isolate the impact of moisture, dust, static electricity, etc. on the wafer. The test is to select available wafers to be the last step before the wafer is shipped. Aike's advanced packaging weighs relatively high. In addition to wired packaging (Wire Bond), most packaging technologies are advanced packaging, and common ones include Crystal Crystal Package (Flip Chip) and Crystal.
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2025-03-28 (chiefexecutive.net)
Regional Report: West/Southwest
Economic growth in the nation's Southern and Western states is being fueled by expansion in the manufacturing and tech sectors.
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2024-12-23 (openpr.com)
Flip Chip Technology Market to See Huge Growth by 2030 | Intel Corp, Samsung Electronics, Texas Instruments
Press release - Advance Market Analytics - Flip Chip Technology Market to See Huge Growth by 2030 | Intel Corp, Samsung Electronics, Texas Instruments - published on openPR.com
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2024-12-17 (malaya.com.ph)
AMID GLOBAL INDUSTRY SHIFT: Silicon chip makers seek govt support - Business Insight
American semiconductor companies operating in the country are clamoring for government incentives, infrastructure support, and skills training to keep their operations here instead of weighing the profitability of alternative locations in other countries. The companies were part of a delegation organized by the Apl.de.Ap Foundation International (APLFI) who visited the Ionics factory in Laguna on […]
Read more![[News] SK hynix Rumored to Team up with Amkor to Secure HBM Advantage over Samsung](/wp-content/uploads/2023/10/sean-pollock-PhYq704ffdA-unsplash.webp)
2024-07-18 (trendforce.com)
[News] SK hynix Rumored to Team up with Amkor to Secure HBM Advantage over Samsung
As Samsung eagerly accelerates its pace on the HBM3e certification with NVIDIA, SK hynix, the current HBM market leader, is reportedly planning anothe...
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2021-11-11 (samsung.com)
Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications | Semiconductor EMEA
H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit.
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2021-11-11 (businesswire.com)
Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technol
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2021-09-02 (prnewswire.com)
Fan-out Wafer-Level Packaging Market to Record Growth Worth USD 1.60 billion during 2021-2025 with Samsung Electronics Co. Ltd. and Amkor Technology Inc. Emerging as Dominant Players |Technavio
/PRNewswire/ -- Set to grow by USD 1.60 billion during 2021-2025, Technavio's latest market research report estimates the fan-out wafer-level packaging market...
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2021-08-05 (prnewswire.com)
Research and Markets - Global System-in-Package Market 2016-2020: Growth of OSAT Vendors with Amkor Technology, ASE, JCET, SPIL & UTAC Dominating
/PRNewswire/ -- Research and Markets has announced the addition of the "Global System-in-Package Market 2016-2020" report to their offering. The global SiP...
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