Amkor Assembly & Test (Shanghai) Co., Ltd.
Location
Shanghai
Founded
2001-08-28
Website
Risk Signals
410 news mentions monitored
Industry Context
This company is tracked across risk categories, including those related to its sector (e.g., Semiconductors and Related Devices, Electronic Parts and Equipment, Not Elsewhere Classified, Business Services, Not Elsewhere Classified), including supply chain integrity, ESG practices, labor disputes, and regulatory compliance.
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Recent Articles about Amkor Assembly & Test (Shanghai) Co., Ltd.
Live alerts from global media, monitored by Business Radar
2025-02-07 (hindustantimes.com)
Apple expected to launch MacBook Pro and MacBook Air with M5 chip soon: Here’s what to expect | Laptops-pc News
Apple is developing new MacBook Pro and MacBook Air models with the M5 chip, expected to launch in late 2025. Here’s everything you need to know.
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2024-12-23 (openpr.com)
Flip Chip Technology Market to See Huge Growth by 2030 | Intel Corp, Samsung Electronics, Texas Instruments
Press release - Advance Market Analytics - Flip Chip Technology Market to See Huge Growth by 2030 | Intel Corp, Samsung Electronics, Texas Instruments - published on openPR.com
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2024-11-17 (quantumzeitgeist.com)
Lightmatter and Amkor Unveil World’s Largest 3D Photonics Package
In a groundbreaking partnership, Lightmatter, a leader in photonic supercomputing, has teamed up with Amkor Technology, a leading provider of semiconductor packaging and test services, to create the world's largest 3D-packaged chip complex. This collaboration brings together Lightmatter's innovative Passage platform, which uses 3D-stacked photonic engines, and Amkor's advanced multi-die packaging expertise to meet the unprecedented interconnect scaling and power demands of today's Artificial Intelligence (AI) workloads. The partnership aims to overcome the limitations of traditional chip design by integrating more silicon in a single package. Lightmatter's Passage platform enables optical I/O anywhere across the chip area, providing significantly higher connection density and bandwidth both within and outside the package. Ritesh Jain, SVP of Engineering and Operations at Lightmatter, hailed the partnership as a "pivotal step" in building a world-class ecosystem for AI and high-performance computing offerings.
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2024-10-23 (vietnamplus.vn)
The semiconductor industry in Vietnam: opportunities created by American investments
After 16 years of expansion of the administrative boundaries of the capital (August 1, 2008), the Hoa Lac Technopole has developed into a scientific and technological urban zone.
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2024-10-07 (stocktitan.net)
Amkor Technology to Announce Third Quarter 2024 Financial Results on October 28, 2024
Amkor Technology to release Q3 2024 financial results on Oct 28. Join the live webcast and conference call at 5 PM ET for insights into the semiconductor packaging leader's performance.
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2024-10-07 (applenovinky.cz)
Apple supplier TSMC and Amkor signed an agreement to cooperate on the production of chips
Apple chip maker TSMC and chip maker Amkor announced on Thursday that the two companies have signed an agreement to collaborate on chip manufacturing, packaging í and testání in Arizonaě. In a press release, the company stated that the closure of its factories in Arizona
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2024-01-24 (semiengineering.com)
Fan-Out Panel-Level Packaging Hurdles
The economics look attractive, but first the industry needs convergence on panel size, process tools, and materials.
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2023-11-30 (fonearena.com)
Amkor to build US$ 2 billion Arizona facility, will package Apple Silicon chips
Amkor Technology, a leading semiconductor packaging and test services provider, has unveiled plans
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2023-11-30 (tomshardware.com)
Apple to become first customer for Amkor's $2 billion Arizona chip packaging facility
The advanced packaging facility will be in Arizona.
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